単結晶AIN Wafer (窒化アルミニウムウエハー)

標準スペック

Growth Method VGF
Orientation (100)±0.5° (311)A,B±0.5° (111)A,B±0.5°
Size (mm) 50.8~100
Thickness (μm) 350±25~625±25
TTV (μm) ≤4
Warp (μm) ≤10
Surface Side1:Polished         Side2:Etched
Conduction Type N-type(S,Sn Dopant) P-type(Zn dopant)    SI-type (Fe doped  )
EPD(Ave cm2) ≤100~5000 ≤5000 1500~5000
Mobility(cm2/v.s) (1.0~5)×103 50~100 ≥1000
(300K) Resistivity (Ω·cm) N/A N/A >1.0×107
(300K) Carrier Concentration (cm-3) (0.5~4.0)×1018 N/A
Package Packaged in individual containers in a class 100 clean room environment.

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